No-Clean Soldering.

No-Clean Reflow Process Implementation

ne of the corporate goals at AT&T is to eliminate chloroflurocarbons (CFCs) from its manufacturing operations by the end of 1994. Many alternatives have been implemented to meet this objective, including noclean wave soldering using low-solids flux, aqueous cleaning of water-soluble flux, aqueous cleaning with saponifiers and semiaqueous (terpene) cleaning. Part 1 of this article describes the ...

A No-Clean-Flux Review

The use of no-clean fluxes in liquid and solid form has grown considerably primarily for two reasons: to reduce costs and to minimize the environmental impact of soldering operations. At the same time, considerable work is progressing on no-clean fluxes for solder pastes. In order to build confidence in the technology, it is essential to prove that no-clean fluxes can produce good soldering per...

No Clean Bill of Health for Csg

The Queensland Government’s Health Report, ‘Coal seam gas in the Tara region: Summary risk assessment of health complaints and environmental monitoring data, March 2013’, [Health Report] and the reports on which it is based, do not provide a comprehensive investigation of the potential impacts of coal seam gas (CSG) activities on the residents of Tara. The Health Report should not be used by go...

Precision Application of No-Clean Fluxes

T he no-clean manufacturing process involves several interrelated process steps. These steps include receiving a clean PCB; surface-mount paste screening, placement and reflow; throughhole component placement; flux application; and wave soldering. This article will focus on the application of flux to effectively obtain soldered boards with low residual flux levels. Existing technologies for flu...

Ersa wave soldering systems